Test Technology of Automotive Grade Chip: Methods, Challenges and Applications
DOI:
https://doi.org/10.54097/cp75ws71Keywords:
Automotive Grade Chip, Methods, Challenges, ApplicationsAbstract
With the development of automobile electronization and intelligence, the reliability and performance of automobile grade chip are very important. This article provides an in-depth exploration of the current status, challenges, and applications of automotive specification chip testing technology. Firstly, the traditional testing methods, such as functional verification, performance evaluation, single chip testing, defect screening and electrical parameter verification, are summarized, and the advanced testing technologies, including energy-saving test optimization, multi-layer and vertical chip testing, embedded core component testing and intelligent and automatic means, are introduced. Secondly, it analyzes the technical challenges faced by the chip test of automotive regulation level, such as the increase of chip complexity, the stability in extreme environment and the safety requirements of automatic driving function; Cost challenges, such as the increase in test coverage and complexity; And standardization challenges, such as the update of international standard system and the particularity of RF chip testing. Finally, through the application of 3D stacked chips in the intelligent cockpit controller and the functional safety test case of MCU based on ISO26262, the practical application of the car-gauge chip test technology is demonstrated. The purpose of this paper is to provide reference for the development of chip testing technology for automotive specifications, and to promote the progress of related technologies, thus contributing to the safe and reliable development of the automobile industry.
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[1] Li Hui, Hu Yan. Research on the Development Status of Domestic Automotive Grade Chips [J]. Electronic Product Reliability and Environmental Testing, 2025, 43(04): 1-7.
[2] Cai Jingjing. Analysis and Suggestions for the Development of Shanghai's Automotive Chip Industry [J]. Shanghai Automobile, 2025, (04): 58-61.
[3] Liu Yuying, Chen Chao, Wu Haiwen, et al. Research on Safety and Reliability Certification Scheme for Automotive Grade Chip Products [J]. Standard Science, 2024, (10): 60-64.
[4] Fang Hongyan, Li Hui. Overview, Issues, and Countermeasures of China's Automotive Grade Chip Development [J]. Automobile & Accessories, 2024, (12): 40-43.
[5] Wu Jianfei, Zheng Yifei, Li Binhong, et al. Research Progress on Electromagnetic Compatibility of Automotive Grade Chips [J]. Safety and Electromagnetic Compatibility, 2022, (02): 16-23.
[6] Zhang Song, Hu Huijing, Wei Jinbo, et al. Research on Environmental Reliability Test Standards for Automotive Grade Chips under the Background of Localization [J]. Era Automobile, 2022, (10): 4-6.
[7] Liu Shuning, Su Duanduan, Nan Jiang. Research on Interface Testing Technology of Automotive Grade Communication Chips [J]. Information Technology and Standardization, 2022, (08): 39-45.
[8] Ding Yining. Evolutionary Game Analysis of Cooperative R&D of Domestic Automotive Grade Chips [J]. Science and Technology and Industry, 2022, 22(11): 245-253.
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